“Heat pipe” is
a device (of arbitrary form: a tube, a plate, etc.) transferring
heat from its hotter surface to its colder surface due to evaporating
a liquid (water, etc.) and condensing its vapor in this device’s
inner hollow. This liquid evaporates near this hollow’s hotter surface
and its vapor condensates near this hollow’s colder surface. The
condensed liquid then returns to the hotter end due to gravity or
by a wick. If such a device operates under its design conditions,
the heat transfer rate provided by this device exceeds substantially
any value achievable by a solid body of similar dimensions.
Restriction:
This feature is available for the Electronics Cooling module
users only.
In Flow Simulation a Heat Pipe is modeled simplistically
as an extremely heat-conducting body. To model real efficiency of
a heat pipe, a non-zero thermal resistance can be assigned to it.